Lead-Free
Lead-FreeProducts
JEAN-151
JEAN-151 is a halide-free, no-clean solder paste formulation with ROL0 classification and improved slump behavior to prevent bridging and solder beading. The standard alloy SAC305 is particularly suitable for the reflow process.
F3+
F3+ is a halide-free, no-clean solder paste formulation with REL0 classification that can be combined with many lead-free alloys. The standard alloy SAC305 is especially suitable for the reflow process. For higher requirements calling for higher silver content, S9
OT2
OT2 is a halogen- and halide-free, no-clean solder paste formulation in the ROL0 class, compatible with many lead-free alloys. OT2 supports printing speeds of up to 250 mm/s and, thanks to its balanced activator system, reduces typical oxidation defects such as graping and head-in-pillow.
SP
SP is a REL0 class bismuth no-clean solder paste formulation for low-temperature applications. SP is designed with the low-melting standard alloy BSA04 for reflow and vapor phase processes. Its 138 - 142°C melting range protects temperature-sensitive components.
Request a Quote
Pricing, lead time and integration details for Lead-Free