Solder paste for reflow and vapor phase soldering
SP is a REL0 class bismuth no-clean solder paste formulation for low-temperature applications. SP is designed with the low-melting standard alloy BSA04 for reflow and vapor phase processes. Its 138 - 142°C melting range protects temperature-sensitive components.
Packaging and storage
| Jar | Polypropylene [g] | 500 |
|---|---|---|
| Small cartridge | High-density polyethylene [g] | 650 |
| Large cartridge | High-density polyethylene [g] | 1300 |
| Cassettes | [g] | 800 |
| Shelf life (months) | ||
| Storage conditions | 4 - 10°C | 5 |
Classification
| DIN-EN-ISO-9454-1: 2016 | 1232 | |
|---|---|---|
| IPC-J-STD-004-A: 2004 | REL0 | |
| IPC-J-STD-005: 1995 (powder) | T3 | |
| Particle size | [µm] | 25-45 |
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Pricing, lead time and integration details for SP
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