OTES Elektronik

Solder paste for reflow soldering

OT2 is a halogen- and halide-free, no-clean solder paste formulation in the ROL0 class, compatible with many lead-free alloys. OT2 supports printing speeds of up to 250 mm/s and, thanks to its balanced activator system, reduces typical oxidation defects such as graping and head-in-pillow.

OT2 is a halogen- and halide-free, no-clean solder paste formulation in the ROL0 class, compatible with many lead-free alloys.
OT2 supports printing speeds of up to 250 mm/s and, thanks to its balanced activator system, reduces typical oxidation defects such as graping and head-in-pillow. The standard alloy SAC305 is particularly well suited to the reflow process. For higher requirements, the SAC405 alloy with a higher silver content is available. The SN100C®, SCA0703 and SCAN-Ge071 alloys can also be used in the reflow process. In addition, the melting range of the SCAN-Ge071 and SCA0703 alloys makes them ideal for vapor-phase applications to minimize tombstoning effects.

Packaging and storage

JarPolypropylene [g]500
Small cartridgeHigh-density polyethylene [g]650
Large cartridgeHigh-density polyethylene [g]1300
Cassettes[g]800
Shelf life (months)
Storage conditions4 – 10°C12

Classification

DIN-EN-29454-1: 19941.1.3.C
IPC-J-STD-004-A: 2004ROL0
IPC-J-STD-005: 1995 (powder)T3/T4
Particle size[µm]25-45/20-38

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Pricing, lead time and integration details for OT2

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