OTES Elektronik

Solder paste for reflow and vapor phase soldering

JEAN-151 is a halide-free, no-clean solder paste formulation with ROL0 classification and improved slump behavior to prevent bridging and solder beading. The standard alloy SAC305 is particularly suitable for the reflow process.

JEAN-151 is a halide-free, no-clean solder paste formulation with ROL0 classification and improved slump behavior to prevent bridging and solder beading.
The standard alloy SAC305 is particularly suitable for the reflow process. With the standard alloy, JEAN-151 is the only printing paste available down to particle size 5. In addition, the silver-free, bismuth-containing solder SN100CV® is available for the highest reliability requirements. The SN100C® and SCAN-Ge071 alloys can also be used in the reflow process. Furthermore, the melting range of the SCAN-Ge071 and SN100CV® alloys is ideal for use in the vapor phase to minimize tombstoning effects.

Packaging and storage

JarPublic domain [g]500
Small cartridgeHigh-density polyethylene [g]650
Large cartridgeHigh-density polyethylene [g]1300
Cassettes[g]800
Shelf life (months)
Storage conditions4 – 10°C12

Classification

DIN-EN-ISO-9454-1: 20161122
IPC-J-STD-004-A: 2004ROL0
IPC-J-STD-005: 1995 (powder)T3/T4/T5
Particle size[µm]25-45/20-38/15-25

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Pricing, lead time and integration details for JEAN-151

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