Electronic Production

The answer depends on board mix rather than on volume alone, so OTES starts from the boards themselves: component count per board, component types and package sizes, batch size and how often the line changes over. The AIMEXR, NXTR S and NXTR A cover different points on that range, and the NXT Series and AIMEX Series heads change what a given machine can pick and at what rate, so the head configuration is part of the decision. A high mix line with frequent changeovers is usually limited by setup rather than by placement rate, which points towards feeder and changeover tooling such as the Auto Loading Feeder. OTES runs this sizing exercise with the production team before any configuration is quoted.

OTES does not quote a fixed duration, because the schedule depends on the scope: a single placement machine added to a running line, a complete line from printer to unloader, or a relocation of existing equipment. What is planned in advance is the sequence. Site preparation covers floor layout, power, compressed air and extraction. Installation places and levels the machines and sets conveyor heights across the whole line. Commissioning covers machine calibration, first article programs, feeder data, SPI and AOI inspection program setup, and reflow profiling on real boards. Operator and programmer training runs alongside commissioning so the team is productive at handover. OTES gives a project specific timeline after the site survey.

Yes. OTES supplies Balver Zinn lead free solder pastes in the JEAN-151, F3+, OT2 and SP grades alongside the equipment. This matters because paste behaviour, stencil design, printer settings and reflow profile form one system rather than four separate choices, and selecting a paste in isolation from the printing and reflow process is a common cause of printing defects and voiding. When OTES commissions a line, the paste in use is part of the parameter set that gets validated on real boards through SPI measurement and inspection after reflow. Consumable and spare part supply continues after handover, together with technical service across Türkiye for the installed equipment.

Yes, and it is a common retrofit. PARMI 3D SPI and AOI systems, including SigmaX, Xceed and Xceed MP, can be inserted into an existing line provided there is floor space and the conveyor heights and transfer signals match. SPI goes directly after the printer, where it measures printed paste volume, area and height and stops a printing problem before components are placed. AOI is normally placed after reflow to check joints, polarity and component presence. OTES surveys the line, confirms the mechanical and electrical interface, supplies any board handling needed to make space, installs and commissions the system, and trains the team on programming and on interpreting results.