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With the NXT III / IIIc, Fuji has developed the 3rd generation of its highly successful NXT series with more than 66,000 installed modules worldwide. For multifunctional and high-performance electronic devices such as mobile phones and automotive applications, both the number of components to be assembled and the possible functions have increased further. Accordingly, the mounting density of small components increases sharply. On the other hand, requirements such as the assembly of shielding plates, very small grid-connected components, and package application components on the package show that the requirements for the functionality of assembly machines are becoming more and more demanding every year. The NXT III / IIIc is designed as a scalable docking platform that also meets the needs of next generation components (such as 03015), providing both high efficiency and quality. It also provides high compatibility with its predecessor NXT II. Many existing machine elements such as insertion heads, tray and feeder units can even be used on the NXT III / IIIc.

-Perfect for high volume production and high product mix
-New servo control for faster and more accurate motor control
-New, more stable design of X / Y axes and machine frame for higher speed and higher precision
-Further improvement in throughput of the full component spectrum, medium and large components 03015 using the new “Flying Vision System”
-Support the next generation component (03015) with the new, super fast layout H24S (24 Nozzles, 35,000 CPH) and faster feeders W08f
-Intuitive and easy to use machine with Touch Panel Interface
-Scalable depending on required feeder positions and yield 2 types of modules: M3 (width 325mm, 20-step Feeder) or M6 (width 650mm, 45-step Feeder)
-Head change in minutes without tools
-Feeder replacement is possible without stopping the machine during production
-Compatible with the AIMEX series

Using the appropriate placement heads, each NXT III / IIIc module can be customized to your production conditions. Thus, NXT III / IIIc covers your entire component spectrum.

The platform allows not only the assembly but also the integration of additional functions:

-Glue dispensing
-3D Solder Paste Inspection
-Component Inspection

Advantages

-SHORT ACCEPTANCE OF LINE LENGTH
-CONTINUOUS SOFTWARE
-SIMPLIFIED OPERATION
-REDUCTION IN MAINTENANCE COSTS

	M3 III	M6 III
APPLICABLE PCB SIZE (UXG)	48 x 48 mm to 250 x 510 mm (double conveyor)* 48 x 48 mm to 250 x 610 mm (single conveyor) *Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.	48 x 48 mm to 534 x 510 mm (double conveyor)* 48 x 48 mm to 534 x 610 mm (single conveyor) *Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.
PARTS TYPES	Up to 20 types of parts (calculated using 8 mm tape)	Up to 45 types of parts (calculated using 8 mm tape)
PCB LOADING TIME	For double conveyor: 0 sec (continuous operation) For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules)	For double conveyor: 0 sec (continuous operation) For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules)
PLACEMENT ACCURACY (FIDUCIAL MARK STANDARD) * PLACEMENT ACCURACY IS GIVEN FROM TESTS PERFORMED BY FUJI.	H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00 V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00 H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00 H08/H04 : +/-0.050 mm (3sigma) cpk≥1.00 H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00 H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00 GL : +/-0.100 mm (3sigma) cpk≥1.00	H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00 V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00 H08M/H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00 H08/H04/OF : +/-0.050 mm (3sigma) cpk≥1.00 H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00 H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00 GL : +/-0.100 mm (3sigma) cpk≥1.00
PRODUCTIVITY * THE SPACE ON IT IS BASED ON TESTS PERFORMED IN FUJI.	H24G: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode) V12: 26,000 cph H12HS: 24,500 cph H08: 11,500 cph H04: 6,500 cph H04S: 9,500 cph H04SF: 10,500 cph H02: 5,500 cph H02F: 6,700 cph H01: 4,200 cph G04: 7,500 cph G04F: 7,500 cph GL: 16,363 dph (0.22 sec/dot)	H24G: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode) V12: 26,000 cph H12HS: 24,500 cph H08M: 13,000 cph H08: 11,500 cph H04: 6,500 cph H04S: 9,500 cph H04SF: 10,500 cph H02: 5,500 cph H02F: 6,700 cph H01: 4,200 cph G04: 7,500 cph G04F: 7,500 cph 0F: 3,000 cph GL: 16,363 dph (0.22 sec/dot)
SUPPORTED PARTS	H24G: 03015 to 5 x 5 mm, Height: up to 2.0 mm V12/H12HS: 0402 to 7.5 x 7.5 mm, Height: up to 3.0 mm H08M: 0603 to 45 x 45 mm,Height: up to 13.0 mm H08: 0402 to 12 x 12 mm, Height: up to 6.5 mm H04: 1608 to 38 x 38 mm, Height: up to 9.5 mm H04S/H04SF: 1608 to 38 x 38 mm, Height: up to 6.5 mm H02/H02F/H01/0F: 1608 to 74 x 74 mm (32 x 180 mm), Height: up to 25.4 mm G04/G04F: 0402 to 15 x 15 mm, Height: up to 6.5 mm	H24G: 03015 to 5 x 5 mm, Height: up to 2.0 mm V12/H12HS: 0402 to 7.5 x 7.5 mm, Height: up to 3.0 mm H08M: 0603 to 45 x 45 mm,Height: up to 13.0 mm H08: 0402 to 12 x 12 mm, Height: up to 6.5 mm H04: 1608 to 38 x 38 mm, Height: up to 9.5 mm H04S/H04SF: 1608 to 38 x 38 mm, Height: up to 6.5 mm H02/H02F/H01/0F: 1608 to 74 x 74 mm (32 x 180 mm), Height: up to 25.4 mm G04/G04F: 0402 to 15 x 15 mm, Height: up to 6.5 mm
MODULE WIDTH	320 mm	645 mm
MACHINE DIMENSIONS	L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III) W: 1900.2 mm, H: 1476 mm	L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III) W: 1900.2 mm, H: 1476 mm

	DYNAHEAD(DX)
NOZZLE QUANTITY	12	4	1
THROUGHPUT (CPH)	25,000 Parts presence function ON: 24,000	11,000	4,700
PART SIZE (MM)	0402 (01005″) to 7.5 x 7.5 Height: Up to 3.0 mm	1608 (0603″) to 15 x 15 Height: Up to 6.5 mm	1608 (0603″) to 74 x 74 (32 x 100) Height: Up to 25.4 mm
PLACEMENT ACCURACY (FIDUCIAL MARK BAZLI REFERANSLAMA)	+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00* *+/-0.038 mm obtained with rectangular chip placement (high accuracy tuning) under optimal conditions at Fuji.	+/-0.040 mm (3σ) cpk≥1.00	+/-0.030 mm (3σ) cpk≥1.00
PART PRESENTATION CONTROL	o	x	o
PARTS SUPPLY BAND	o	o	o
PARTS SUPPLY STICK	x	o	o
PARTS SUPPLY TRAY	x	o	o

	PARTS SUPPLY SYSTEM
INTELLIGENT FEEDERS	Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape
STICK FEEDERS	4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)
TRAY	Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M)，276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)

OPTIONS
Tray feeders, PCU II (Pallet Exchange Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Fujitrax

*Contact Otes Elektronik for unit combinations and other detailed specifications.