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NXT III / IIIc – Fuji scalable placement platform


With the NXT III / IIIc, Fuji has developed the 3rd generation of its highly successful NXT series with more than 66,000 installed modules worldwide. For multifunctional and high-performance electronic devices such as mobile phones and automotive applications, both the number of components to be assembled and the possible functions have increased further. Accordingly, the mounting density of small components increases sharply. On the other hand, requirements such as the assembly of shielding plates, very small grid-connected components, and package application components on the package show that the requirements for the functionality of assembly machines are becoming more and more demanding every year. The NXT III / IIIc is designed as a scalable docking platform that also meets the needs of next generation components (such as 03015), providing both high efficiency and quality. It also provides high compatibility with its predecessor NXT II. Many existing machine elements such as insertion heads, tray and feeder units can even be used on the NXT III / IIIc.

-Perfect for high volume production and high product mix
-New servo control for faster and more accurate motor control
-New, more stable design of X / Y axes and machine frame for higher speed and higher precision
-Further improvement in throughput of the full component spectrum, medium and large components 03015 using the new “Flying Vision System”
-Support the next generation component (03015) with the new, super fast layout H24S (24 Nozzles, 35,000 CPH) and faster feeders W08f
-Intuitive and easy to use machine with Touch Panel Interface
-Scalable depending on required feeder positions and yield 2 types of modules: M3 (width 325mm, 20-step Feeder) or M6 (width 650mm, 45-step Feeder)
-Head change in minutes without tools
-Feeder replacement is possible without stopping the machine during production
-Compatible with the AIMEX series

Using the appropriate placement heads, each NXT III / IIIc module can be customized to your production conditions. Thus, NXT III / IIIc covers your entire component spectrum.

The platform allows not only the assembly but also the integration of additional functions:

-Glue dispensing
-3D Solder Paste Inspection
-Component Inspection

Their big advantage:

-SHORT ACCEPTANCE OF LINE LENGTH
-CONTINUOUS SOFTWARE
-SIMPLIFIED OPERATION
-REDUCTION IN MAINTENANCE COSTS

M3 IIIM6 III
APPLICABLE PCB SIZE

(UXG)
48 x 48 mm to 250 x 510 mm (double conveyor)*
48 x 48 mm to 250 x 610 mm (single conveyor)
*Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.
48 x 48 mm to 534 x 510 mm (double conveyor)*
48 x 48 mm to 534 x 610 mm (single conveyor)
*Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.
PARTS TYPESUp to 20 types of parts (calculated using 8 mm tape)Up to 45 types of parts (calculated using 8 mm tape)
PCB LOADING TIMEFor double conveyor: 0 sec (continuous operation)
For single conveyor: 2.5 sec (transport between M3 III modules),
3.4 sec (transport between M6 III modules)
For double conveyor: 0 sec (continuous operation)
For single conveyor: 2.5 sec (transport between M3 III modules),
3.4 sec (transport between M6 III modules)
PLACEMENT ACCURACY

(FIDUCIAL MARK STANDARD)

* PLACEMENT ACCURACY IS GIVEN FROM TESTS PERFORMED BY FUJI.
H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00
V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00
H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00
H08/H04 : +/-0.050 mm (3sigma) cpk≥1.00
H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00
H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00
GL : +/-0.100 mm (3sigma) cpk≥1.00
H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00
V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00
H08M/H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00
H08/H04/OF : +/-0.050 mm (3sigma) cpk≥1.00
H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00
H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00
GL : +/-0.100 mm (3sigma) cpk≥1.00
PRODUCTIVITY

* THE SPACE ON IT IS BASED ON TESTS PERFORMED IN FUJI.
H24G: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)
V12: 26,000 cph
H12HS: 24,500 cph
H08: 11,500 cph
H04: 6,500 cph
H04S: 9,500 cph
H04SF: 10,500 cph
H02: 5,500 cph
H02F: 6,700 cph
H01: 4,200 cph
G04: 7,500 cph
G04F: 7,500 cph
GL: 16,363 dph (0.22 sec/dot)
H24G: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)
V12: 26,000 cph
H12HS: 24,500 cph
H08M: 13,000 cph
H08: 11,500 cph
H04: 6,500 cph
H04S: 9,500 cph
H04SF: 10,500 cph
H02: 5,500 cph
H02F: 6,700 cph
H01: 4,200 cph
G04: 7,500 cph
G04F: 7,500 cph
0F: 3,000 cph
GL: 16,363 dph (0.22 sec/dot)
SUPPORTED PARTSH24G: 03015 to 5 x 5 mm, Height: up to 2.0 mm
V12/H12HS: 0402 to 7.5 x 7.5 mm, Height: up to 3.0 mm
H08M: 0603 to 45 x 45 mm,Height: up to 13.0 mm
H08: 0402 to 12 x 12 mm, Height: up to 6.5 mm
H04: 1608 to 38 x 38 mm, Height: up to 9.5 mm
H04S/H04SF: 1608 to 38 x 38 mm, Height: up to 6.5 mm
H02/H02F/H01/0F: 1608 to 74 x 74 mm (32 x 180 mm), Height: up to 25.4 mm
G04/G04F: 0402 to 15 x 15 mm, Height: up to 6.5 mm
H24G: 03015 to 5 x 5 mm, Height: up to 2.0 mm
V12/H12HS: 0402 to 7.5 x 7.5 mm, Height: up to 3.0 mm
H08M: 0603 to 45 x 45 mm,Height: up to 13.0 mm
H08: 0402 to 12 x 12 mm, Height: up to 6.5 mm
H04: 1608 to 38 x 38 mm, Height: up to 9.5 mm
H04S/H04SF: 1608 to 38 x 38 mm, Height: up to 6.5 mm
H02/H02F/H01/0F: 1608 to 74 x 74 mm (32 x 180 mm), Height: up to 25.4 mm
G04/G04F: 0402 to 15 x 15 mm, Height: up to 6.5 mm
MODULE WIDTH320 mm645 mm
MACHINE DIMENSIONSL: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III)
W: 1900.2 mm, H: 1476 mm
L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III)
W: 1900.2 mm, H: 1476 mm
DYNAHEAD(DX)
NOZZLE QUANTITY1241
THROUGHPUT (CPH)25,000
Parts presence function ON: 24,000
11,0004,700
PART SIZE

(MM)
0402 (01005″) to 7.5 x 7.5
Height: Up to 3.0 mm
1608 (0603″) to 15 x 15
Height: Up to 6.5 mm
1608 (0603″) to 74 x 74 (32 x 100)
Height: Up to 25.4 mm
PLACEMENT ACCURACY

(FIDUCIAL MARK BAZLI REFERANSLAMA)
+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00*
*+/-0.038 mm obtained with rectangular chip placement (high accuracy tuning) under optimal conditions at Fuji.
+/-0.040 mm (3σ) cpk≥1.00+/-0.030 mm (3σ) cpk≥1.00
PART PRESENTATION
CONTROL
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PARTS SUPPLY BANDooo
PARTS SUPPLY STICKxoo
PARTS SUPPLY TRAYxoo
PARTS SUPPLY SYSTEM
INTELLIGENT FEEDERSSupport for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape
STICK FEEDERS4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)
TRAYApplicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M),276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)
OPTIONS
Tray feeders, PCU II (Pallet Exchange Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Fujitrax

*Contact Otes Elektronik for unit combinations and other detailed specifications.